Las Vegas, Nevada, January 10, 2018 –Techniplas, a leading global design and manufacturing provider of automotive products and services, announced today it is bringing its latest products and services to CES 2018. Show attendees are invited to experience the company’s cognitive lighting and lightweighting capabilities, and how it is integrating and using additive manufacturing within the automotive industry at booth #9100 in the Las Vegas Convention Center.
Techniplas will exhibit a unique concept vehicle packed with its most advanced lightweighting capabilities, including a tailing suspension arm boasting a 40% weight reduction, several tire rim designs and seat backs. Additionally, the company is demonstrating a first of its kind cognitively-lit sunroof that is programmable, and designed to demonstrate how car surfaces are transitioning from core functionality into expanded human-to-machine interfaces.
This year, Techniplas is partnering again with Swiss mobility visionary Rinspeed to deliver
the Snap, a modular vehicle with interchangeable pods that attach to a rolling chassis skateboard, housing data-processing computers and the EV power train. The company’s engineers designed and 3D printed the Snap’s front and rear facia modules with embedded cognitive lighting, which communicate with other cars as well as pedestrians using colors and symbols. Techniplas also provided a multi-functional light engine capable of multi-media display functions, which is housed in the Snap rocker panels. CES attendees are welcomed to experience this year’s revolutionary Rinspeed Snap powered by Techniplas at the Harman booth located at the Hard Rock Hotel in Las Vegas.
The company is also unveiling Techniplas Prime, a proprietary e-manufacturing platform that leverages its core engineering expertise and manufacturing facilities together with dozens of its qualified manufacturing partners, and new additive and generative technologies to fulfill orders placed through its new platform worldwide. Techniplas Prime is first to provide automated lightweighting solutions, additive manufacturing options with instant pricing quotations and localized manufacturing.
The company is bringing to CES several of its open innovation program partners including Nexa3D, Nano Dimension and ParaMatters. Together, they are providing the latest additive and generative technologies within the program’s ecosystem to quickly become the preeminent hub for industry 4.0 collaboration.
Techniplas is a leading global design and manufacturing provider of engineered products and services that are helping to shape the future of mobility. Our 2,000 associates around the world are passionate about making the connected world. By continuously expanding the reach of our data-enabled cognitive technologies into everything we do, we deliver personalized, performance-enhanced and sustainable mobility. For more information, please visit www.techniplas.com.